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TR Subassembly Hermetic Packages

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TR Subassembly Hermetic Packages

Brand Name : JOPTEC

Place of Origin : HEFEI, CHINA

MOQ : 50 PCS

Payment Terms : T/T

Supply Ability : 5000000 PCS/Month

Delivery Time : 30 Days

Packaging Details : Boxes

Application fields : DC power supply

Lead welding method : gold wire bonding

Nickel layer thickness : >3μm

Gold layer thickness : > 0.45μm

Hermeticity : leak rate ≤1x10-3Pa.cm3/s (He)

Insulation resistance : ≥1000MΩ (DC500V

Base : Kovar alloy

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Main performance parameters

Application fields: DCDC power supply, filter, modulator
Lead welding method: tin welding, gold wire bonding
Nickel layer thickness: >3μm
Gold layer thickness:> 0.45μm
Hermeticity: leak rate ≤1x10-3Pa.cm3/s (He)
Insulation resistance: ≥1000MΩ (DC500V)
material:
Base: Kovar alloy, iron-nickel alloy, copper
Ring frame: Kovar alloy, steel
Lead: Kovar alloy, iron-nickel alloy, copper core composite
Cover plate: Kovar alloy, iron-nickel alloy, steel
Insulator: DM308 or similar, iron sealed glass beads, ceramic
Sealing process and technology: parallel seam welding, laser welding, tin sealing welding, stored energy welding


Product Tags:

DM308 hermetic package

      

DC TR Integrated hermetic package

      

modulator Subassembly hermetic package

      
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